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Technology 1-3
Cutting material groups
HW
Uncoated carbide, main component tungsten carbide (WC), grain size = 1 μm
CC
Cutting ceramic as above, but coated
HF
Uncoated carbide, main component tungsten carbide (WC), grain size = <1 μm
DM
Monocrystalline diamond
HT
Cermet, TiC/TiN basis
CVD-D
CVD diamond, polycrystalline
HC
Carbide/cermet, as above, but coated
DP
Polycrystalline diamond
CA
Cutting ceramic, main component aluminum oxide (AI2 O3)
CM
Fused ceramic, main component aluminum oxide (AI2 O3) together with other components as oxides
BL
Cubic crystalline boron nitride with low boron content (CBN 40 – 65%)
CN
Silicon nitride ceramic, main component silicon nitride (Si3N4)
BH
Cubic crystalline boron nitride with high boron content (CBN 70 – 95 %)
CR
Cutting ceramic, main component aluminum oxide (AI2 O3)
BC
Cubic crystalline boron nitride as above, but coated (CBN 70 – 95 %)
DM Mono- crystalline diamond
CVD-D Polycrystalline
CR CA
CM Cutting ceramics
CN+CC
HT Cermet
Uncoated carbide
HC
Coated carbide
HF
Fine-grain carbide
HW
DP Polycrystalline diamond
BC coated CBN BH CBN 70 – 95% BL CBN 40 – 65%
Description of cutting materials as per DIN ISO 513 (2001)
Durability
Diamond technology LLC
© DiaTec – Diamant technology LLC Technical modifications reserved All dimensions in mm
V 2.0
Wear resistance